How different is the coding of CC3200 from msp430

connect and single pair

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1 knowledge. Impulses. Contacts. 16 B August, 00 Connect securely with BLE and nfc and single pairs Bluetooth Low Energy (LE) and NFC stand for fast data transfer and low energy consumption. Out-of-band pairing dramatically increases the security of connections. FPGA accelerates optical inspection Fast processors and FPGAs make test throughput faster and more efficient Page40 Architectures for the industrial sector Comparison of the Industry 4.0 architecture RAMI with the approach of the Industrial Internet Consortium Page48 Thermal management shed light on How materials, electricity, the environment and other factors influence thermal behavior Page62

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3 EDITORIAL Despite all the skepticism: The IoT deserves a chance Are you skeptical about buzzwords such as IoT or Industry 4.0? Then you are not alone: ​​A good number of decision-makers in the German economy think like you. A current survey by Deutsche Messe Interactive and the network specialist Brocade showed that 21 percent of the decision-makers surveyed are of the opinion that Industry 4.0 is not yet relevant to them. Another 24 percent consider the term Industry 4.0 to be too vague, which explains the uncertainty surrounding the implementation of the topic. Even for some technicians, the IoT is a mockery of traditional engineering principles. The networking of everything with everything is, for example, diametrically opposed to the tried and tested principle of parts and rule, which is about breaking down complex systems into small, and therefore more manageable, units. And, to be honest: As long as piles of paper with all-encompassing specifications are being produced in the typically German regulatory madness on the subject of Industry 4.0, no one should be surprised when leaner, pragmatic approaches win the competition of ideas in the IoT. I look forward to seeing you at the IoT Congress on September 14th and 15th in Munich (Franz Graser, editor, however: The potential of the IoT is enormous. An example: A company that builds electric vehicles can At the same time, offer a fleet management solution based on the data recorded during operation. This creates a new business model. And you don't have to be a prophet to be able to predict that remote maintenance of machines and systems will be one of the most important applications in industrial IoT. In this sense : Give the IoT a chance, because it will not disappear from the scene. If necessary, it will be given a different name, as people used to speak of pervasive computing. Find out more, exchange ideas with developers and users. Congress on September 14th and 15th in Munich. I'm looking forward to seeing you! (Sincerely, your NEW from Panasonic: PAN93X0 SERIES Integrated WiFi Stack accesspoint, TCP / IP AdHoc on board 2MB F lash on board, of which 1MB for the customer application temperature range -30 C to +70 C on request with development environment and software Developmet Kit sample storage available at Endrich 3

4 CONTENTS No. EMBEDDED COMPUTING Bluetooth LE and NFC for secure connection and easy pairing If you operate Bluetooth LowEnergy (LE) radio applications that have extremely low power consumption, completely new application possibilities arise. A secure out of band (OoB) Bluetooth pairing and proximity applications based on BLE IoT systems are of growing interest. Both fields of application are described in more detail here, just as the latest semiconductor solutions and tools can simplify their implementation. 19 ELEKTRONIKSPIEGEL 6 Figures, Data, Facts 10 News & Personnel 12 Event 13 Sectors & Markets FOCAL POINTS Embedded Computing COVER SUBJECT 19 Bluetooth LE and NFC for secure connections Bluetooth Low Energy and NFC stand for fast data transfer and low energy consumption. On their own, both involve certain risks. Out-of-band pairing dramatically increases the security of connections. Analog technology 30 Linear equalization in multi-gigabit systems Linear equalization is important for processing fast signals. It guarantees robust and error-free operation with serial protocols such as 10GbE, PCIe and SAS. Metrology 40 An FPGA Accelerates Optical Inspection Faster test throughput in optical inspection is no problem thanks to better processors. Image processing is also more efficient thanks to FPGAs. 44 USB type C cable test with DisplayPort operating mode Video signals can be transmitted via USB type C cables. The DisplayPort operating mode is provided for this purpose. Internet of Things 48 Two architectural approaches for the industrial Internet RAMI 4.0 and IIRA are terms that appear in the context of Industry 4.0. This article shows what they mean, what they have in common and what makes them different. 50 The Industrial Internet as the backbone of Industry 4.0 Why the collaboration between the Industrial Internet Consortium (IIC) and Industry 4.0 is an opportunity for medium-sized companies. 53 Intelligent environmental monitoring with ThingWorx The collection of environmental data, for example by manually taking soil or water samples, is cumbersome and expensive. Remote data collection offers many advantages in this regard. Power supplies 56 Buck converters for field sensor applications Intelligent field sensor applications place high demands on a power supply, since the signals coming from the sensor should be transmitted as undisturbed as possible. LED lighting 62 The thermal management of an LED The thermal management of LED lights played an essential role. There are various materials on the market that influence the thermal behavior of the system. 4th

5 An FPGA accelerates 40 optical inspection 53 Environmental monitoring with ThingWorx 56 Buck converter for field sensor applications Thermal management for a 62 LED TIPS & SERIES 16 Disruption due to switching frequency and switching transitions When designing power supplies with switching regulators, great care is required in sensitive applications. Milestones in electronics 26 A solid foundation for real-time software For over 30 years, Green Hills Software has been developing the technologies that underpin today's systems. 34 From housing manufacturer to system provider 55 years ago, the first compact housings were produced in Rittershausen. 54 Würth Elektronik eisos More thanyou expect! The development, manufacture and sale of components is often determined by quantity and price. CONNECTOR Mercury 433 MHz wireless module for Wireless M-Bus Mercury is a highly integrated, extremely energy-saving and cost-effective wireless M-Bus module with a small connection area. An energy-saving, programmable microcontroller Cortex M0 + is integrated in the module, on which a fully functional M-Bus protocol stack is implemented. The module also includes a balun matched to the SPIRIT1 transceiver, which enables a connection to external antennas. For more information and support, please contact your local EBV Elektronik partner, the leading specialist in semiconductor products in EMEA, or visit ebv.com/mercury. 66 Darren Halford, EU Automation Direct or alternating current the current war continues RUBRIKEN 3 Editorial 65 Imprint Distribution is today. Tomorrow is EBV. 5

6 ELECTRONIC MIRROR // NUMBERS, DATA, FACTS NOTE: Ruben de Rijcke / WikimediaCommons August 12, 1981: The IBM PC 5150 IBM has dominated the mainframe market since the 1950s, but the development of small computers was initially underestimated. At the end of the 1970s, Big Blue had to watch as companies like Apple, Commodore or Tandy pushed into the market and conquered it. Therefore, in August 1980, a team of 12 led by Philip Don Estridge was given the task of producing their own personal computer within a year. In order to meet the deadline, the developers mainly resorted to already available components from third-party manufacturers: The main processor Intel 8088 was an easily accessible standard chip, extensions were added via breadboards in 5ISA slots. The PC-DOS operating system was not written by the company itself, but was licensed by a small software company called Microsoft. From 1984 the IBM PC and its successors established themselves as the office standard, not least because other manufacturers could easily replicate them and put their own compatible PCs on the market at low cost. // SG 6

7 ELECTRONIC MIRROR // FIGURES, DATA, FACTS TURNED UP: TBS2000 Mini-Antenna Spin Wave In the future, so-called spin waves will serve as naturally shaped antennas instead of electrical currents. However, small wavelengths in the nanometer range are necessary. Thanks to a new concept, scientists were able to generate short-wave spin waves. In addition to the small expansion of the spin wave, the wavelength can be precisely adjusted by selecting the excitation frequency. In addition, the speed of propagation depends on the direction. // HEH display There is no touch built-in in the price category, but the WVGA display has a diagonal of 9 '' and 15 horizontal time segments. Help function With HelpEverywhere the user can call up appropriate help depending on the respective measurement situation. Learning Teachers can use the Coureware Resource Center to supply themselves with tasks and load them directly into the oscilloscope. The TBS2000 from Tektronix is ​​a basic oscilloscope that can be used not only in the development laboratory, but also very well for study and teaching. Well thought-out help functions support, depending on the respective software, TekSmartLab Application V3.0 manages the oscilloscopes from a central computer by distributing tasks centrally. Analysis 20 million points can be recorded. With the pan and zoom function, the signals can be recorded using a rotary knob. Connections Connect to the oscilloscope for voltage and current probes that conform to the TekVPI and BNC standards. Measurement function supports the user in his work. For example, different triggers are explained or the different types of oscilloscopes. Tektronix also provides an entire ecosystem for learning. // HEH PICKED UP 33 Twitter If I find another project that becomes obsession and more, I'll be twice as lucky Chris Urmson, ex-head of development for self-driving cars at Google, spends 33 minutes and 25 seconds on his plans for the future Average iphone user in the USA with the augmented reality game Pokémon Go every day. This was determined by the SensorTower data service in mid-July. This means that the usage time is significantly longer than that of popular social media such as Facebook, Snapchat, or Instagram. SeymourPapert, AI pioneer The native South African founded the Artificial Intelligence Lab at MIT together with Marvin Minsky. As a student of the pedagogue Jean Piaget, he advocated the use of computers in education and developed the programming language Logo. Papert died on July 31st at the age of 88. // FG 7

8 ELECTRONIC MIRRORS // SEMICONDUCTOR TRENDS Structural miniaturization according to Mooreist until 2021 dead With the traditional Moore law it will be over by 2021, predicts the Semiconductor Industry Association (SIA). 3-D integration processes are replacing the classic 2-D scaling of transistors. Moore's law, according to which the number of transistors on a chip doubles at regular intervals and the efficient performance increases accordingly, has been declared dead several times in the past. One of the reasons for this is that chip development according to this principle in the classic sense depends on how finely the structures can be manufactured. The planar scaling of transistors and the reduction of their distances from one another on silicon is becoming more and more difficult and is increasingly reaching the limits of what is physically possible. It should be over by 2021 at the latest. Moore's law is dead long since Moore's law. The 2015 International Technology Roadmap for Semiconductors (ITRS) of the Semiconductor Industry Association (SIA) comes to this and other conclusions. Because even if the limits of classic 2-D scalability are reached, new technologies such as 3-D stacking will be able to continue to maintain the prediction made by Gordon Moore; however not purely about the structure reduction. The report bases its statement on the fact that the meaning of Moore's Law has changed over the years, but that the essence of the statement has been preserved. However, a fundamental change has taken place in the industry itself. Originally it was the case that block manufacturers drove technological change and device manufacturers used their knowledge and advances to develop their products. However, these signs have changed: The industry is increasingly being driven by device or SoC-centric models, for whose requirements an increasing number of fabless chip manufacturers are specifically producing new, better IPs and components. Smartphone development or the Internet of Things, for example, are extremely shaped by the fact that chip developers are able to handle an increasingly large number of From 2-D interconnect to 3-D stack: According to ITRS, new integration options should drive semiconductor production in the future. Above all, knowledge from memory and SoC manufacturers comes into play here. To combine peripherals as well as memory and high-performance processors in just one component. New technologies and materials on the advance First steps towards new manufacturing methods have already been taken. Memory manufacturers in particular, such as Toshiba with its 3-D NAND stacking, are already operating the first technologies for 3-D integration for their manufacturing processes. Between 2021 and 2024, says the ITRS, the first processors will also be manufactured using 3-D techniques. Manufacturers of memory modules have always been leaders in the production of semiconductors with the tightest tolerance and smallest dimensions, says the SIA report. They were the real driving forces behind Moore's Law and will remain so in the future. According to the report, more and more manufacturers will integrate materials other than silicon into their components within the next six years. Silicon-germanium alloys or other examples of III-V semiconductors using materials from groups III and V of the periodic table (such as gallium arsenide GaAs), which are currently mainly used in power semiconductors, will therefore tend to become the norm from 2021 onwards. The first steps have already been taken in processor production: In 2015, for example, IBM presented a first test chip with a 7 nm structure size based on silicon-germanium. Moore's Law is dead long live Moore's Law The conclusions from the ITRS are that improved processor performance lies in new architectures that are manufactured with the help of 3-D integration processes, optimized multithreading and application-specific cores and generally improved memories. In contrast, the times of simply reducing the distance between transistors and steadily increasing the clock rate should be over in five years at the latest. You can find the unabridged version of this article on elektronikpraxis.de. // SG SIA Image: SIA 8

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10 ELECTRONIC MIRROR // NEWS & PERSONNEL ANALOGUE TECHNOLOGY Analog Devices buys Linear Technology Merger: Analog Devices is taking over competitor LinearTechnology for a sum of around 14.8 billion US dollars. Image: Analog Devices The merger of AnalogDevices and Linear Technology brings together the two strongest companies in the semiconductor business, explains Vincent Roche, President and CEO of Analog Devices. We create an unparalleled innovation and support partner for our customers in industry, the automotive sector and in communication infrastructure, Roche continues. Both companies serve the same markets: industry, automotive and communications infrastructure and have a similar product portfolio that now includes interface modules, amplifiers, converters, clock generators, HF and power management solutions. Adi benefits greatly from Linear's position in the power sector Management, the brand will remain in the future. The analog specialist expects the market to double from $ 8 billion to $ 14 billion. Bob Swanson, CEO and co-founder of Linear, added: By combining our complementary technical strengths, we have an excellent opportunity to strengthen our leadership in analog and power in the semiconductor market. Vincent Roche will become CEO of the merged company and David Zinsner, SVP and CFO of ADI, will support the combined company in this position. The leadership will consist of members from both companies. The acquisition is expected to be completed in the first half of 2017. // KR Analog Devices 3-D PRINTING Optical lenses, almost as fine as a hair With 3-D printing, micro-lenses can be produced that consist of several lenses. Researchers at the University of Stuttgart have combined a short-pulse laser with optical photoresist to produce lenses that are barely larger than the diameter of a hair. For this purpose, a laser with a pulse duration of less than 100 femtoseconds is focused using a microscope into a liquid photoresist that has previously been applied to a glass plate or to a glass fiber. Two photons of the laser beam with a wavelength of 785 nanometers are simultaneously absorbed at the focal point and expose it. This hardens the photoresist. With a scanner or by moving the substrate in all three spatial directions, the laser beam can follow the desired shape that is to be produced. This enables optical freeform surfaces to be produced with submicrometer accuracy.The precision makes it possible not only to manufacture spherical lenses, but also surfaces such as paraboloids or higher-order aspheres. Multi-lens lenses for images of the highest quality are also possible. The doctoral student Timo Gissibl from Professor Harald Giessen's group at the 4th Physics Institute printed such micro-objectives on glass fibers. This allows flexible endoscopes to be realized that penetrate into the smallest body orifices or into machines. // FG University of Stuttgart Size comparison: submicrometer triple lens compared to the compound eyes of an ordinary housefly. Image: University of Stuttgart DRONE Near collision with quadrocopter puts human life at risk Popular aviation: The unmanned aircraft pose a potential threat to air traffic. Image: Pixabay At the beginning of August, a Lufthansa Airbus A321, which was approaching Munich Airport, narrowly escaped a collision with a drone. According to a report by Bayerischer Rundfunk, the meeting took place at an altitude of around 1700 meters above the town of Schwabhausen in the Dachau district. The Lufthansa Airbus with flight number LH 116 was occupied by 110 people. According to media reports, one of the pilots of the aircraft discovered the unmanned aerial vehicle while looking out of a side cockpit window. The quadrocopter had therefore approached the right wing tip of the Airbus to about ten meters. Markus Wahl, the spokesman for the cockpit pilots union, called for consequences. Against the background of the danger to air traffic from the unmanned missiles, the spokesman for the pilots' association called for more education for the drone operators and technical devices so that the missiles in the vicinity of airports cannot even ascend or fly higher than 50 meters. However, Thursday's near-collision did not occur in the immediate vicinity of Munich Airport; Schwabhausen is about 32.5 kilometers as the crow flies from Franz-Josef-Strauss-Airport. However, the place is in the approach path of Munich Airport. // FG Cockpit Association 10

11 ELECTRONIC MIRRORS // NEWS & PERSONNEL ACOUSTIC COMPONENTS German and Japanese customers rely on reliability When it comes to acoustic components such as piezo or magnetic buzzers, but also small speakers, capacitors, headphones, Bluetooth speakers or sound amplifiers, the Taiwanese manufacturer Kingstate is the right address . The company has existed since October 1977 and since February 2007 it has been selling its products directly to customers. In addition to the headquarters in Taipei, the company has two Chinese locations. In Taipei I spoke to Acoustic Components: EmilyChen is responsible for international sales at Kingstate and Jeff Hsieh is responsible for research and development. Image: ELEKTRONIKPRAXIS with Emily Chen, who is responsible for international sales at Kingstatever. In the highly competitive acoustic components market, we rely on Germany and Japan, among others. However, it is not easy to convince German customers of the products. A special product that the company will be presenting this year are headphones, which are made from lightweight aluminum, among other things. Waterproof headphones will also be presented in Munich. Important industrial customers come from the automotive industry: For them, the company offers loudspeakers and microphones as well as piezo sirens and buzzers for acoustic signaling. Emily Chen says that German and Japanese customers in particular are not looking for the cheapest components, but that reliability is what counts for them. That's why Kingstate is back at productronica this year. // HEH KingstateElectronics CORPORATE MANAGEMENT Schukat and Mean Well, 20 years of sales cooperation Schukat electronic was founded in 1964 by Hans-GeorgSchukat in Monheim am Rhein and is an independent family company to this day. Characterized by continuous growth, the siblings Georg, Bert and Edith Schukat are now in the second generation to run the business. Schukat has a longstanding partnership with numerous manufacturers from the active, passive and electromechanical sectors. One of them is Mean Well. This year, distributor Schukat and Mean Well, manufacturer of switching power supplies, look back on two decades of successful cooperation. The foundation for the sales activities was laid in 1996, which led to the authorized distribution of Mean-Well products in 2000. Schukat has always had the entire Mean Well program in its portfolio and has been able to build up a wealth of experience with switched-mode power supplies. By helping to spread the brand on the market and promoting the sale of products, Schukat is now one of Mean Well's most important partners in Germany. For further viewing, the smallest in its class! AC / DC print module with only 28.7x12.7x17.5mm at 5W 3-25W, 5-24Vdc, -40 C to +85 C working temperature, protection class II 5-year guarantee cooperation you have set proud goals. We want to increase our sales with Mean Well by 20 percent in the coming years, says Bert Schukat, Managing Director Schukat. Demand is plentiful. We are currently seeing niche markets such as harsh environment, medical and battery charging technology as well as the areas of Industry 4.0 and the trend towards increasing energy efficiency as drivers for technically mature switched-mode power supplies. In the coming years, Schukat wants to introduce even more compact power supplies from Mean Well with new circuit topologies in the upper performance range, in LED lighting the completely new and extremely powerful EELG series from 75 to 240 W. Functions such as IP67, fanless operation, 6 kV Surge immunity and the proven 3-in-1 dimming make them extremely attractive for customers. Smart dimming, ZigBee and DALI will also be available from Schukat in the future. Schukat has around 2,500 Mean Well articles in its warehouse, and thanks to sophisticated logistics, more can be delivered at short notice. The close cooperation between the partners opens up great advantages for customers: JenkoAtaman-Fotolia.com A mean-well laboratory at Schukat that was set up in 2013 enables modifications, pre-checks and analyzes. In addition, our own Mean Well specialists advise Schukat customers personally on the selection of the right switched-mode power supply. In addition to the standard goods, there is also the option of customer-specific products and design-in. As an authorized distributor, Schukat has access to resources and is in close contact with Mean Well engineers. Direct communication with the management is also important for the constant growth of the range. Bert Schukat: We have been successful in the power supply sector for over 20 years. In addition to high-quality products, customers always receive full support from us and benefit from the sophisticated logistics, simple procurement and technical support through to design-in. Schukat sees a particular challenge in continuing to steadily increase sales. The aim will be to find new markets, niches and customers. // MK Schukat 11

12 ELECTRONIC MIRROR // EVENT The CADFEM ANSYS Simulation Conference is back in Nuremberg CADFEM ANSYS Simulation Conference: Many visitors took advantage of the large range of lectures and obtained information in the accompanying exhibition. The importance of simulation in current and future technology topics will be demonstrated on the first day of the 34th CADFEMANSYS Simulation Conference in the opening plenum. Speakers from Qualcomm, the Reinhausen machine factory and the University of the Federal Armed Forces were won over. In addition, RobertKocis from ANSYS, Inc. (VicePresident, Worldwide Sales and Customer Excellence) will give a general overview of the ANSYS platform. The rest of the first day is dominated by technology updates on AN-SYS and by overview sessions for simulation in selected application areas such as Internet of Things, electronics, multi-body simulation, particle simulation and turbo machines: The second day of the conference, Thursday, is marked by significantly more than 100 lectures from industry and research on the use of simulation in a wide variety of industries and areas of application. Also represented are presentations by employees from AREVA, BMW Group, Conti Temic Microelectronic, Endress + Hauser Flowtec, Hauni Maschinenbau, ITER Organization, MAGNA Powertrain, Robert Bosch, Schaeffler Technologies, SEW-EURODRIVE, Siemens Healthcare and Volkswagen. In addition to the sessions on structure and fluid mechanics, electromagnetics, system simulation and multiphysics, the integrated came conference represents a cross-section of various disciplines in the field of medicine and biomechanics. The final plenary session will again be moderated by TV journalist Brigitte Büscher. The focus of the contributions and the discussion is the digital twin and its growing importance for product development. The 5th Digital Cities Forum will deal with 3D city models and developments in application on Thursday and Friday. On the third day of the conference, half-day compact seminars on current simulation topics will be offered. Since the seminars in the picture: Michael Bahlo are repeated in the afternoon, each visitor can take advantage of two further training offers on one day. The CADFEM Forum has established itself as an integral part of the conference. Moderated by Prof. Dr.-Ing. SandroWartzack from the Friedrich-Alexander-Universität Erlangen-Nürnberg will show company representatives (including from Liebherr-Aerospace, SCHUNK, DLR, Karl Leibinger) in keynote speeches various technical aspects on the subject of simulation and additive manufacturing, which will then be discussed among the participants. CAE specialist exhibition with over 30 exhibitors In the CAE specialist exhibition with more than 30 exhibitors, including the electronic RONIKPRAXIS und Konstruktionspraxis, participants receive first-hand information on products and services, ANSYS and others from the sponsors (Hewlett Packard Enterprise and Intel) and partner companies Complement products, services and knowledge offerings from CADFEM. Of course, the ANSYS specialists from CADFEM and ANSYS are available there for all questions about the efficient use of numerical simulation. The traditional evening event of CADFEM takes place this time in the Germanisches Nationalmuseum (GNM), which is considered the largest cultural history museum in the German-speaking area. In addition to interesting trips back in time, the evening event in the foyer areas of the GNM again offers numerous opportunities to exchange ideas as well as culinary specialties and live music. The recently published conference program contains a full range of information, including the role of simulation in additive manufacturing processes, the implementation of a digital twin or the analysis of particle behavior in the material flow. All information about the CADFEM ANSYS Simulation Conference innürnberg can be found online at the Internet address: www. simulation-conference.com. // JW CADFEM +49 (0)

13 ELECTRONICS MIRROR // INDUSTRIES & MARKETS MOBILE COMMUNICATION Smartphone sales are shrinking COMPARISON OF THE STATES Hamburg is a computer science metropolis In Germany, more smartphones are being sold this year than ever before, but sales are shrinking compared to the previous year. A total of around 27.9 million devices will go over the counter, 6 percent more than a year ago. At the same time, sales are down for the first time since the introduction of smartphones compared to the previous year, by 2 percent to 10.4 billion euros, according to a forecast by the digital association Bitkom. While the average price per device sold last year was € 404, it will drop to € 374 in 2016. // FG Image: oneinchpunch / fotolia.com Share of employees subject to social insurance in ITC professions among all employees in the respective federal state 4.0% 3.5% 3.0% 2.5% 2.0% 1.5% 1.0% 0 , 5% 0% 3.8% 2.9% 2.8% 2.7% 2.7% Hamburg Hesse Baden Berlin Bavaria Württemberg A high in the north: Hamburg has the highest proportion of computer scientists of all federal states, followed by Hesse and Baden -Wuerttemberg. According to Bitkom, Hamburg is the German capital of IT specialists. In the Hanseatic city, 3.8 percent of all employees subject to social insurance work as computer scientists or in other ITC professions. In a comparison of the federal states, that is by far the top position. They are followed by Hessen (2.9 percent), Baden-Württemberg (2.8 percent), as well as Bavaria and Berlin (2.7 percent each). // FG Image: Bitkom INDUSTRY BAROMETER VDMA reports positive order development Incoming orders in the German mechanical and plant engineering sector rose 6 percent over the previous year's level in June. In the entire first half of 2016, according to VDMA, the order level grew by a total of 3 percent year-on-year PC market: Seventh consecutive minus quarter According to Gartner estimates, global PC shipments in the second quarter of 2016 were 5.2 percent compared to the second quarter of the previous year to 64 , 3 million devices declined. This is the seventh negative quarter in a row. PCB manufacturers make a plus The sales of the PCB manufacturers increased by 3.1 percent in May compared to the previous year, reports the ZVEI professional association PCB and Electronic Systems. The backlog accumulated over the first five months has thus been reduced to 0.5 percent. Remuneration for IT experts rises According to a Kienbaum study, the salaries of IT experts continue to develop positively. In the current year, managers earn three percent more and specialists 3.3 percent more than in the previous year. The salary increase across all positions is 3.2 percent. ELECTRICAL INDUSTRY Business climate increases strongly Balance of positive and negative answers, percentage points Jan. 16 Current assessment of the situation Expectations for the next six months Feb. 16 March16 April16 May16 June 16 Positive outlook: Expectations for the coming months (red line) rose sharply, the assessment the current situation rose slightly. According to ZVEI, the business climate in the German electrical and electronics industry improved noticeably in June. Business expectations rose sharply. 33 percent of domestic electrical companies rate their situation as good, 56 percent as stable and 11 percent as bad. However, the survey preceded the Brexit vote in Great Britain. // FG Further market figures can be found at: Image: ZVEI 13

14 World's leading trade fair for components, systems and applications at the Electronics Fair in Munich I November 2016 I electronica.de

15 Connecting Global Competence Planet e: Where the future begins. Tomorrow's electronics. Already today. Tickets & registration: electronica.de/tickets

16 SERIES // POWERTIP Interference caused by switching frequency and switching transitions FREDERIK DOSTAL * Pictures: Analog Devices Fig. 1: Switching frequency and switching transitions of a step-down controller Fig. 2: Filtering of disturbances caused by the switching transitions with a ferrite. When designing power supplies with switching regulators, great care is required, especially in sensitive applications such as measurement technology or high-frequency technology. A switching regulator causes certain disturbances in the system due to its periodic switching behavior. These result from pulse currents and voltages which a switching exciter generates due to the concept. In order to keep the disturbances as low as possible, a good circuit board layout is essential. Different filters are used to minimize the impact of any disturbance that is generated. Various methods are suitable for filtering supply voltages. Linear regulators with a high power supply rejection ratio (PSRR), LC filters or ferrites are used. In order to select the appropriate filter, it is important to know the interference frequencies. It is often assumed that switching regulators only cause interference through the switching frequency. Thus, the switching frequency of the different power supply ICs is carefully considered. Nowadays it is usually between 500 kHz and 3MHz for power supplies without a transformer. * Frederik Dostal ... works in technical management for power management in industrial applications at analog Devices in Munich. However, the switching frequency is only half the story. Another cause of malfunction is the switching transitions of the switching regulator. The switching of current flow during the on time and no current flow during the off time takes place at high frequencies. This switching causes interference in the range from 20 MHz to approx. 300 MHz. Modern switching regulators have particularly short switching times in order to reduce switching losses. Switching transitions of the switching regulator They cause interference of a few hundred MHz. Depending on the switching regulator architecture, the exact frequency also depends on the input and output voltage of the power supply. Information on this interference frequency can not be found in the data sheet of switching controller ICs, so the interference caused is often not expected and therefore not fought in a targeted manner. Figure 1 shows the cause of the switching frequency of a switching regulator as well as the much faster frequency of the switching transitions. This behavior can lead to malfunctions in the system. In addition to these two fundamental frequencies, one also receives periodic multiple signals in the frequency domain. Interference caused by the switching frequency can be reduced relatively easily with linear regulators or LC filters. In the range between 500 kHz and 3 MHz, linear regulators have a fairly high PSRR and can filter well. With LC filters, low-pass filters can also be optimized very easily for the frequency range below 500 kHz and 3 MHz.Ferrites are particularly suitable for effectively reducing the high-frequency interference caused by the switching transitions. Figure 2 shows a step-down switching regulator with a suitable filter, which has been optimized for the high switching transition frequencies of 100 MHz, for example. The filter consists of a small ferrite and a small capacitor. A ferrite has a certain impedance curve over frequency. In Figure 2 a ferrite was selected which has an impedance of 100 Ω at 100 MHz. A linear regulator would not be able to filter effectively and reduce interference at such high frequencies. Another very important aspect with any type of filter, especially when filtering the high frequencies of the switching transitions, is a clean ground reference. In Figure 2 the ground connection of the system is shown in blue. High-frequency interference on this line would be coupled to the supplied circuit regardless of the filter shown in Figure 2. So-called ground bounce is to be ensured in particular by a generally optimized circuit board layout and optimized routing of the mass flows. // KR Analog Devices 16

17 Five days of pure embedded software engineering: Everything you need to know for your projects. Take advantage of early bird prices: Book by October 31, 2016 and save! Program now online: ESE congress develop ideas, meet professionals, find solutions. The Embedded Software Engineering Congress with over participants is the largest German-speaking event that is exclusively dedicated to the development of device, control and system software for industry, motor vehicles, telecommunications, as well as consumer and medical technology. The embedded software industry will meet again in Sindelfingen from November 28th to December 2nd. We look forward to seeing you! Exhibitors and Sponsors 2016: AdaCore agosense aicas ARM Axivion bbv Software Services Eclipseina ELEKTRONIKPRAXIS Embedded Tools Embedded Wizard emmtrix Technologies emtrion EVOCEAN Express Logic froglogic Green Hills Software Hitex IAR Systems IBM IMACS Infineon Technologies isyst MicroConsultic Software isystem Lauterbachoft MentronLieber Graphics Logic Technology isyst Intelligente Systeme isystem Lauterbachoft LieberLieber MicroSys Model Engineering Solutions oose Innovative Informatik Parasoft PikeTec PLS Programmable Logic & Systems PROTOS QA Systems QNX Software Systems Razorcat Development Renesas Electronics RST Industrie Automation RTI Real-Time Innovations SMDS / University of Augsburg Synopsys SYSGO Tasking Vector Software Verifysoft Technology Verum Willert Software Tools WITTENSTEIN XiSys Software up to in Sindelfingen Gold Sponsors 2016 Organizer

18 EMBEDDED COMPUTING // DATA COMMUNICATION COVER STORY If wireless applications with extremely low power consumption are operated with Bluetooth Low Energy (LE), completely new application possibilities arise, especially when the advantages of NFC technology are added. A secure out of band (OoB) Bluetooth pairing and proximity applications based on BLE IoT systems are of growing interest. Both fields of application are described in more detail here, just as the latest semiconductor solutions and tools can simplify their implementation. Toshiba supplies simple semiconductor solutions for out-of-band pairing and bluetooth beacons. 18th

19 EMBEDDEDCOMPUTING // DATA COMMUNICATION Bluetooth LE and NFC for secure connection and easy pairing Bluetooth Low Energy and NFC stand for fast data transfer and low energy consumption. Both of these alone carry certain risks. Out-of-band pairing dramatically increases the security of connections. HEINER TENDYCK * Pictures: ToshibaElectronicsEurope Reference design: Combined BLE and NFC design based on Toshiba's TC35670 Bluetooth Low Energy + NFC Tag IC, Bluetooth and NFC antenna Bluetooth Low Energy (BLE) is the energy-saving successor version of Bluetooth that is used for the Internet of Things (IoT) was developed. Bluetooth SIG (Special Interest Group) improved its BLE technology with the launch of version 4.2 in December 2014. This version offered additional functions such as improved data cyphering, support for the Internet protocol and faster speeds compared to version 4.1. The further developed specification Bluetooth 5 was announced for the end of 2016. Classic Bluetooth * Heiner Tendyck ... istprincipalengineer, System LSI MarketingDepartment Wireless Solutions, Toshiba Electronics Europe offers advantages such as long range, is omnipresent and can be implemented cost-effectively. BLE ensures significantly lower power consumption, making it suitable for battery-powered mobile and wearable platforms that master the IoT. Modern devices such as smartphones offer the BLE function as standard. Near-Field Communication (NFC) is also being added more and more frequently. NFC enables payments or access control as well as security-related functions if Bluetooth communication could be intercepted by hackers. This is known as the Man in the Middle (MITM) scenario. NFC offers radio transmission that differs significantly from Bluetooth. The transmission distance with NFC is up to 10cm. The amount of data that can be transmitted with NFC is limited and is strictly controlled depending on the choice of embedded NFC security scheme used. Bluetooth, on the other hand, can transmit many types of data over a distance of up to 100m. Out of Band (OoB) ensures secure pairing Combining the security of NFC with the open communication of Bluetooth results in numerous advantages. Bluetooth offers AES-128 encryption, which is robust enough against audio attacks and the decryption of intercepted data packets. However, security and user-friendliness can be increased if NFC comes into play; since NFC requires close proximity, there is no man-in-19

20 EMBEDDED COMPUTING // DATA COMMUNICATION Use of BLE beacons: Beacons enable localized marketing and a number of other business usage scenarios - the middle problem and prevent an undesired connection without the knowledge or permission of the user. This is done by transmitting security keys for the pairing information, called out-of-band (OoB) pairing, and works within the limited NFC transmission range. NFC pairing is extremely simple and takes place by touching or being in close proximity to two devices. Let us consider e.g. Smart meters that are read out at intervals of several weeks or months. The wireless meter interface can remain switched off until a technician places an NFC reader or an NFC-enabled mobile device in close proximity (tagging). The initial energy for activating the counter is provided via an NFC antenna. The BLE part can be in deep sleep mode the entire time in order to guarantee minimal power consumption, since the BLE IoT node does not have to check any transmission requests (advertising) if it is not needed for a longer period of time. After the credentials of the reader have been confirmed, a BLE connection can be established. Out of Band (OoB) pairing in practice Although this may sound complex at first glance, pairing and data transfer in practice are quite simple and intuitive. NFC and Bluetooth both play out their strengths. First, the mobile device is placed near the NFC-enabled device. Although it may sound complex at first glance, OoB pairing and data transfer are very simple and intuitive in practice. Heiner Tendyck, Toshiba Electronics Europe Small form factor: The TC35667FTG-based development kit measures only 17mm x 20mm. A smartphone or tablet then touches a payment terminal or an office printer, for example. In devices with Toshiba's TC35670Bluetooth LowEnergy + NFC Tag IC, the energy from the NFC antenna in the mobile device activates the permanently installed device. This then transmits its Bluetooth credentials securely via NFC. The mobile device recognizes the permanently installed device and begins the pairing request and the transmission of security keys via NFC. This eliminates the need to review and enter a string to confirm that the correct devices are being connected. The secure transmission prevents the security keys from being accidentally or maliciously intercepted by a man in the middle attack. The pairing is now complete and both devices can carry out a secure AES-128-encrypted Bluetooth communication for data transmission. An application can now be started on the mobile device depending on the format of the NFC data. Bluetooth beacons: new applications emerge The proximity detection with NFC and the subsequent secure data transmission via BLE open up new application possibilities. One of them are beacons. These are extremely energy-saving, simple devices that transmit simple data such as e.g. Send web addresses to devices (and thus to their users) in the vicinity. Beacons are suitable for numerous indoor applications, e.g. for advertising, navigation, building management and inventory control. As soon as a beacon is positioned, app users can receive localized notifications in the vicinity, provided the app is activated. Beacons are usually very energy efficient and are operated by a small button cell battery that lasts for weeks, months or even years. In retail, customers can be directed to specific products that they select on the app. Special offers can also be pointed out in this way. In a supermarket, beacons can help customers take away the most efficient way to do all of their shopping. In the business environment, goods equipped with beacons can be tracked and localized in order to increase security and ensure efficient operation (including maintenance). Marketing teams are constantly coming up with new ideas around this technology and application scenarios for beacons. In a stadium or theater, for example, beacons can guide the audience to their seats. Further application possibilities can be found in sales when offering merchandising, special offers and the processing of discounts for advertising products. These are a few examples where BLE and NFC work together to open up new possibilities. Beacons are usually unidirectional and send simple information such as an Internet address or a location. In another application, however, the beacon software and content could be updated wirelessly or via BLE (over-the-air update), triggered and secured by NFC pairing. The connection to 20

21 Engineering Leadership EMBEDDEDCOMPUTING // DATA COMMUNICATION Function overview: The SDK is a fully equipped tool based on established technology. The future has begun Tagging a beacon via NFC is much easier than pairing via Bluetooth. It is also more secure because no security information can be intercepted. Rapid development and implementation of beacon technology As with all new technologies, the appropriate hardware and software must be available in order to be able to gain market share quickly when it is introduced. One of the biggest challenges is the steep learning curve many development teams have to go through when implementing this new technique. In order to be able to bring fully functional beacons to market quickly, Toshiba offers an independent reference design based on the ultra-low power BLE IC TC35667 and the combined BLE + NFC tag IC TC35670. The reference design consists of a small (17mm x 20mm) module. It contains the TC35667FTG as well as oscillators, EEPROM, an integrated antenna and test connections with 1.27mm pin spacing. A connection for an external NFC antenna is also available (with the TC35670). When sending advertising or information, the maximum power consumption is only 5.9mA. In deep sleep mode this value drops to only 0.1μA. The average power consumption depends on the selected transmission cycle. If this happens every second, the average power consumption is around 30uA. The reference design also offers a variety of custom options. The IC can be exchanged in order to use Bluetooth 4.1 (TC35676) or Bluetooth 4.2 (TC35678) with embedded flash memory (instead of external EEPROMs) for the application. Extensive support and documentation is available in the form of circuit diagrams, parts lists, layout guidelines, Gerber files and antenna patterns. A module solution (from Panasonic Europe: PAN1760 / PAN1761) is also available. A starter kit from Toshiba supports programming and debugging based on common C ++ debuggers. Toshiba also offers a Bluetooth Software Development Kit (SDK), a complete solution that simplifies the use of Toshiba's Bluetooth LSIs and speeds time to market. This solution is available free of charge from Toshiba's developer website. It supports multiple chipsets and platforms, including host-based and stand-alone Bluetooth low-energy systems, SPPover BLE profiles and the combined BLE + NFC function. The software API supports BLE GATT server and client as well as the GAP central & peripheral function. Minimal development effort is required to configure a beacon that works with one of these standards. The developer simply sets the data format in a data array and makes a function call to configure the beacon. A C ++ standard debugging environment then takes care of the compilation and execution of the SDK code and the beacon is in operation. The integration of all available beacon standards ibeacon (Apple), AltBeacon (Radius Networks), EddystoneTM (Google) etc. is thus easily possible via Toshiba's SDK. // SG ToshibaElectronicsEurope SMARC 2.0 is the new standard for low-power computer-on-modules SMARC2.0 specification by SGeT e.v. Optimized for ARM / RISC as well as x86 processors With new, innovative high-speed interfaces and typical embedded signals Two formats: 82 x80mm and 82 x50mm Robust and inexpensive 314-pin connector SMARC 2.0 starter kit is available Already available: msc SM2S-IMX6 Small module format, ARM Cortex -A9 CPU NXP i.mx6 Quad / Dual / DualLite / Solo SoC Also with i.mx6 QuadPlus and DualPlus carrier board (Mini-ITX): MSC SM2-MB-EP1 for both module formats, with access to almost all SMARC 2.0 interfaces

22 LATEST PRODUCTS // EMBEDDED SYSTEMS Knowledge is power! Linux training courses 2016 September: Yocto introduction of IoT Security Industry & Real Time With Debian to the Distro October: Distri-Dschungel Linux Tracing (X-Ray) Industry & Real Time IoT Security Linux Advanced November: With Debian to the Distro More info at: LINUTRONIX GMBH Telephone 07556 / BLE4.1 Bluetooth Smart ICs with 46% less power requirement Toshiba is introducing the TC35678FSG, TC35678FXG and TC35679FSG, three new BLE v4.1 ICs for Bluetooth smart devices such as wearables, medical devices, smartphone accessories, remote controls - Murata announces a series of two IEEE b / g / n compliant 2.4 GHz wireless modules based on the SimpleLink chipsets CC3200 and CC3100 from TI. The miniature modules measuring 13.2 x21.45 x2.65 mm simplify the implementation of wireless connectivity in embedded and IoT applications. Both modules (type 1JP and type 1JQ) have SPI and UART interfaces and 16 MBit flash memory and work with a 40 MHz clock frequency. They consist of a circuit board with all gen and future IoT devices in front of it. An efficient DC / DC converter and power-saving circuitry ensure 46% lower power consumption than previous models such as the TC35667FTG. With a 3V supply voltage, the peak current consumption of the new ICs is only 3.6mA in transmission mode and 3.3mA in receive mode. In deep sleep mode this value is reduced to 100na. TC35678FXG and tc35678fsg contain 256KByte Flash ROM for storing programs and data in independent operation without an additional host MCU. The memory capacity for user programs has been increased for both ICs from 64KB to 100KByte, which improves the expansion options for programs. The integrated Flash ROM eliminates the need for external EEPROM and reduces costs and space requirements on the circuit board, as the number of external components is reduced. Toshiba SIMPLELINK Wi-Fi modules for easier IoT connection, suitable components and a board antenna. SPI and UART interfaces as well as numerous GPIO pins are available for connecting peripherals. The 1JP module with TI chipset CC3100 is connected to a host microcontroller that controls communication. The 1JQ module is based on the TI chipset CC3200, with Cortex-M4-MCU and 256 kbyte RAM, is suitable for operation without an external host. The modules are pin-compatible and offer compatibility with the following SimpleLink products. The modules are FCC / IC certified and R & TTE tested for the CE mark. Murata elektronikpraxis.de/newsletter MICROFLAME SOLDERING Video clips and examples of free application trials GSM / GNSS COMBINED MODULE Smallest integration of GSM, GNSS and bluetooth Based on a combination of the Mediatek chipsets MT6261 and MT3333, the MC60 combination module from Quectel supports GSM and GPRS in the 850 frequency bands / 900/1800/1900 MHz and GNSS in the L1 1575.42 MHz and 1601.71 MHz frequency bands. By supporting the GPRS Coding Schemes CS-1, CS-2, CS-3 and cs- 4, a data rate of 85.6 kbps can be achieved in the downlink and uplink, while the low energy consumption in the 2G network is maintained. In addition, the MT6261 supports Bluetooth classic up to Version 3.0. The MC60 supports GPS and GLONASS. It uses up to 33 tracking, 99 acquisition and 210 PRN channels.With an acquisition sensitivity of -148dbm and a tracking sensitivity of -165 dbm as well as a time to first fix of less than 15 seconds from the cold start and less than 1 second from the hot start, the MC60 is for most The MC60 is housed in a 68 pin LCC housing (18.7 mm 15.8 mm 2.1 mm), weighs approximately 1.8 g and is sold by MSC Technologies. MSCTechnologies 22