What is the ENIG surface
In addition to the surface that has been in use for a long time ENIG (E.lectroless Nickel I.mmersion Gold), colloquially "chemical gold", we have also been offering you the further developed surface since August 2017 ENEPIG (E.lectroless Nickel E.lectroless P.alladium I.mmersion Gold).
Thanks to its palladium layer between nickel and gold, this surface is ideally suited as a bondable surface for gold and aluminum wire bonding. Furthermore, this surface combines all the known advantages that are already known at ENIG. The formation of the black pad effect is also ruled out by the palladium separating layer.
|MATERIAL||LAYER THICKNESS||PHOSPHORUS CONTENT|
|gold||0.03-0.08 µm||n / a|
|palladium||0.1-0.3 µm||3-6 %|
|nickel||4-8 µm||7-10 %|
|good shelf life||higher costs compared to ENIG|
|suitable for all soldering processes|
|very suitable for fine pitch / SMD|
|very suitable for bonding|
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