Chinese engineers taught electronics to sweat for cooling

Chinese engineers figured out how to cool the electronics with the help of evaporation of the liquid. For this they have created a coating, which picks up moisture from the air, then vaporizing it by heating. First and foremost is a demand for mobile devices, where it is impossible to install the fan. Description of the invention published in the journal of the Joule.

By operation of the electronic device can get very hot — it’s easy to see, for example, using a resource intensive application on the smartphone. Desktops and laptops are also heated, and for cooling they install radiators and fans. For mobile devices it is ill-suited, and overheating leads to a decrease in performance, software errors, and sometimes permanent damage, so engineers are constantly finding new efficient ways of cooling.

A group of engineers under the leadership of van Rouge (Ruzhu Wang) from Shanghai University of transport has proposed to use the system, vaguely reminiscent of sweating in mammals. To do this, they decided to use ORGANOMETALLIC frame structure (MOF). This composite, composed of nanoscopic particles of polymers and metals. They have a lot of micropores and, in fact, this material made a very effective sponge that is able to collect moisture from the air by themselves. Previously expressed ideas to extract moisture from the air in arid areas by using such composites, but their high price per gram has not yet been possible to make this technology mass.

The idea of the Chinese engineers is simple — to cover the heating surface of the MOF. At low load on the processor, being cold, the material will collect water. When heated, the liquid will begin to evaporate, without allowing the temperature to rise further. The duration of the effect, of course, depends on the amount of stored moisture.

In their experiments, the group of van coated plate with an area of 162 centimeters less than 0.3 grams of MOF. Due to the small amount of material used the price is not greatly increased, but the time of heating the plate to 60 degrees Celsius compared to uncoated with the layer thickness of 198 micrometers doubled with five minutes to eleven. If you increase the thickness of the layer to 516 micrometers, the heating time is 19 minutes. The material quickly takes on water alone recharges when you turn off the heat and then is ready for operation.

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